What materials can the UV laser marking machine engrave with lasers?

Ultraviolet laser marking machine is a series of products of laser marking machine, which integrates international advanced technology. High-energy ultraviolet photons directly destroy the molecular bonds on the surface of many non-metallic materials, so that the molecules are separated from the object. This method will not produce High heat, very small gathering spot of ultraviolet laser, and almost no damage due to thermal influence, so it is called cold processing. The ultraviolet laser marking machine is developed by using a 355nm ultraviolet laser. Compared with the infrared laser technology, the 355 ultraviolet light has a very small focusing spot, which can greatly reduce the mechanical deformation of the material and has a small thermal impact on processing. Because it is mainly used for ultra-fine marking and engraving, it is especially suitable for food and pharmaceutical packaging. Material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers!

The core component of the UV laser marking machine is the UV laser, which has its unique advantages in laser processing: the UV laser has a short wavelength, small focus, It can realize fine processing; UV laser directly destroys the chemical bonds of materials during laser processing, which is a 'cold' treatment process, with a small heat-affected zone, most materials can effectively absorb UV light, and can process many materials that cannot be processed by infrared and visible light lasers. . All-solid-state UV lasers have the advantages of small size, high efficiency, high repetition rate, no gas replacement, no mask, and easy maintenance. Therefore, it has been widely used in bioengineering, material preparation, all-optical optical device fabrication, especially in the laser processing fields of integrated circuit boards and semiconductor industries.

At present, the development of ultraviolet laser is very rapid, and its inherent advantages are gradually revealed. High-repetition-frequency all-solid-state lasers above watt-level power are continuously used in the processing field, and domestic and foreign research institutions and companies are constantly developing towards higher power (tens of watts) and higher repetition frequencies (tens or even hundreds of kHz). At present, we have successfully developed a 5W, 50kHz UV 355nm laser and a finished machine with a pulse width of 25ns. Moreover, the 10W and 30W prototypes have stable performance and are used for scribing LED sapphire wafers. The scribing depth reaches 200μm, the line width is less than 10μm, the scratches are smooth and uniform, and there is almost no heat-affected zone. The current international market price of UV 355nm laser is about At $20,000/W, the medium and high-power all-solid-state UV laser market is occupied by foreign manufacturers. Mainly used for punching, cutting, scribing and marking. Taking the laser dicing machine as an example, according to the current market demand, the sales volume of traditional laser dicing machines is generally 100 units per year, of which 60% will be replaced by ultraviolet all-solid-state lasers; the domestic annual demand for laser marking machines is about 4,000 units. Taiwan, in which all-solid-state UV lasers will replace 30% of the market share.

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