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Uv laser cutting machine and laser marking machine working principle is the same?

with the continuous development of laser marking machine in recent years, more and more business in the process of raw plant processing all choose to use a laser processing, laser technology development brought great convenience for the work of production. In recent days many clients will ask such a question: ultraviolet laser marking machine with laser cutting machine? Laser punching machine? The working principle is consistent between them? Laser marking and can be used for cutting, punching, etc, to use? Elegant. prosper certainly tell you here is ok, details analysis is as follows:

1, the working principle of ultraviolet laser marking machine

uv laser marking machine is very mature relatively simple, direct use laser light through the expanded beam shaping after out to connect to the galvanometer optical system, by high energy beam to the workpiece surface, material formation on the surface of gasification off pattern. In short laser processing system refers to the energy produced by laser beam to the surface of the workpiece material moment gasification formation of cutting, perforation or surface design. The common three types of laser processing technology on the market is divided into vibration mirror machining, collimating mirror machining as well as the objective, its principle is through a variety of reflective lenses make laser energy to focus on a point, through mobile work platform, or move through the lens turn back beam forming processing.

2, the working principle of ultraviolet laser cutting machine

uv ultraviolet laser laser cutting machine is the use of turn-back lens through the beam expander, reflection mirror frames and other optical components connected to the galvanometer optical system, also a part of laser directly after the light by reflecting frames directly to the galvanometer. By high-energy beam in the process of processing multiple or single processing forming cutting or drilling, general process of cutting slot, cutting edge effect, the machining efficiency and machining precision, etc. , have higher requirements.

by uv laser cutting machine and the principle of laser marking machine to the analysis, the principle of which is roughly the same between them, are all through the galvanometer learning system. But there is difference between them, the simple point ultraviolet laser cutting machine is ultraviolet laser marking machine is an updated version.

the galvanometer laser marking machine work width is typically 110/145/175/210/330 mm, so if the processing width more than this value, you need to XY for Mosaic, in order to ensure the accuracy of this kind of stitching, will need to use linear motor or servo motor, but in order to guarantee the production efficiency in the field of micro precision machining are usually choose to use linear motor, the speed is more wide, the accuracy is better. On the premise of guarantee splicing light driven by linear motor is certainly can't fully guarantee the accuracy, or located in large-format work condition need to grab the laser work area, it is need to configure the CCD camera, to grasp the target of the working area, at the same time, the precision machining to fact check the processing effect. Especially in the machining accuracy to the naked eye can not see after about 50 microns, the amplification effect of CCD camera is very important.

different thickness of the material, the focus is not consistent, the rise and fall of the Z axis, guarantee the accuracy of the vibrating mirror and material focus position, Z axis motor movements are also standard. In the process of mobile equipment, in order to ensure the stability of the mobile, there must be a very stable equipment of the machine, in order to guarantee the stability of the machine, laser equipment manufacturers choose solution is marble work platform, and therefore the overall weight of the equipment for nearly 2 tons.

in addition, in the process of ultraviolet laser cutting, drilling, is to make a whole material cut off or perforation, marking machine with low-power laser cannot meet this requirement, you need to use high-power ultraviolet laser, generally refers to more than 10 w laser.

so is not hard to find from the above analysis, the reason we positioning for processing materials for uv laser cutting and laser marking, is based on the nature of the materials and the customer's requirement, actually the working principle is the same. Normally we become micro precision laser machining is more appropriate, uv and uv laser marking is commonly used in the high-end fine places use. Similarly, for other types of laser marking machine and laser cutting machine is the same.

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