3Wuv UV Laser Marking Machine

Laser UV laser marking machine is developed by 355nm UV laser (Huari, Yinggu, Maiman laser), the machine adopts third-order intracavity frequency doubling technology compared with infrared laser, 355 UV light focusing The light spot is very small. The effect of marking is to directly break the molecular chain of the material through the short-wavelength laser, which greatly reduces the mechanical deformation and thermal deformation of the material (belonging to cold light). Because it is mainly used for ultra-fine marking and engraving, it is especially suitable for It is used in food, pharmaceutical packaging materials, KN95 mask marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers and other application industries. Our company uses international advanced technology and cooperates with German and American laser companies to develop an advanced laser marking machine; the ultraviolet laser is an ultraviolet laser beam generated by high-power multi-mode laser diode pumping to generate laser frequency doubling, and then pass through The computer controls the deflection of the high-speed scanning galvanometer to change the optical path of the laser beam to realize automatic marking.

3Wuv UV laser marking machine features: high beam quality, very small spot, can achieve ultra-fine marking; almost perfect marking quality: 355nm output wavelength reduces the need for processing The thermal influence of the parts; the galvanometer type high-precision marking head, the marking effect is fine and repeatable; the high-precision and fine spot ensures the perfect marking results; the marking process is non-contact, and the marking effect is permanent; UV laser marking The machine has a wide range of applications; the heat-affected area is very small, there will be no thermal effect, and the material will not be deformed or scorched; the marking speed is fast and the efficiency is high; the whole machine has stable performance, small size and low power consumption. It is more suitable for processing materials that have a large reaction to heat radiation; it can cooperate with the production line, automatic loading and unloading, automatic feeding and discharging; suitable for marking on most metal and non-metal materials. Application range: silicon wafers, thin ceramics, IC die, various glass, TFT, LCD screen, plasma screen, key fine marking, glass surface marking, silicon wafer marking, PCB processing, flat panel display production, fine-tuning of electronic components, Solar cell material processing.

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