Maintenance and marking machine technology of handheld laser marking machine

Z In recent years, the price of laser marking machines has been declining, from 10,000 to 20,000 to 2,000 to 3,000. The machines are getting cheaper and cheaper, which has led to users' neglect of daily maintenance, so that the machines are often small Problems continue, and even many users do not know how to properly maintain the stamping machine. Here I will summarize the maintenance methods and precautions for work: .

Before working, first check the circulating water. If the work is carried out without water, the engraving effect will become shallower and shallower, and even the laser tube of the laser marking machine will be broken, causing a lot of damage. Great economic loss (if the work is carried out without water, the machine should be turned off immediately and the power supply should be cut off, and then the water should be used for testing after half an hour).

In summer, the weather is hot, you should pay attention to the water temperature, try to use a larger bucket, if the water temperature rises, you should replace the cold water, the weather is cold in winter, remember not to let the circulating water freeze , You can put an appropriate amount of antifreeze in the water.

The circulating water of the laser marking machine should be replaced frequently, and there should be no debris in the water.

Both the stamping machine and the computer host should be grounded before working (the iron rod is smashed into the soil and needs to touch the soil).

The guide rails and small wheels should be cleaned frequently and lubricated with oil.

Always wipe the lens (with alcohol cotton balls) to prevent the lens from being dirty and causing shallow engraving. Just wipe it directly, the focusing lens needs to be removed and wiped).

Always clean up the moisture and sundries inside the stamping machine to prevent moisture from adversely affecting the line (you can use a hair dryer to dry it after cleaning).

Na:YAG laser light source is commonly used in silicon wafer cutting. Silicon wafer laser cutting uses laser irradiation to cause wafer overflow until the material is melted and vaporized, due to light pressure and vaporized substances The recoil pressure causes the melt to be discharged from the incision, the Nd:YAG laser is modulated into a pulsed type, the pulse frequency is 1-50kHz, and the beam is focused into a spot with a diameter of about 0.1mm, and the laser energy density When it can reach 1 to 1 J/c, the laser radiation forms a crescent crater on the surface of the silicon wafer, the laser moves relative to the silicon wafer plate, a two crescent craters overlap, and a continuous scribe line (ablation line) is formed on the surface of the silicon wafer. , and then it is easy to break the silicon wafer along the direction of the ablation line by mechanical methods. The main advantages of laser cutting silicon wafers are: the width of the cutting line is less than a.25mm, and the cutting depth is 2-3 times deeper than that of the diamond scribing, which greatly improves the Yield. The yield is 96I^-98%, the cutting stress is small, the edge is sharp, and there is no crack in brittle materials. The edge of the melting and vaporization of the Si wafer cannot be strictly controlled, and the sputtering of the melt cannot be controlled, so the edge of the cut silicon wafer is not very sharp, and the depth of the surface unevenness is about 50 Tn.

Traditional silicon wafer cutting uses high-speed rotating blade or diamond IC automatic laser marking machine to pre-cut the silicon wafer first, and then book it according to the direction of the cut. Open, because the blade has a certain thickness, the use of this method leads to waste of raw materials, and secondly, the dicing will produce cracks, fragments and other problems, especially at the intersection of the scribe lines, the blade is seriously damaged and the yield is low. In recent years, researchers have tested the use of The low-energy ultraviolet laser replaces the diamond knife to cut the microchip. When cutting the silicon wafer, the special optical system of the laser device focuses the ultra-short-wave laser into a laser beam with a diameter of only a few microns, and uses this energy to concentrate the laser irradiation in a specific space and time. On the silicon wafer to be processed, small holes that are closely adjacent to each other can be directly punched inside the material. This 'drilled' hole material can be easily 'opened' to obtain an ideal microchip. This method is used to carry out The entire cutting process is automatically carried out under computer control, which is fast and precise. Secondly, because the laser cuts on the sapphire and the silicon wafer, the aperture is extremely small, and the chip material will not be wasted.

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